| 摘要 |
PURPOSE:To suppress an excess growth of edge bead, and to prevent the large increase of a circuit size and an air reservoir generated at the bead at the time of transferring and laminating by simultaneously adjacently forming dummy circuits when conductor circuits are so formed that adjacent conductor circuits do not exist. CONSTITUTION:A resist mask 12 is formed by a photoresist method, a printing method, etc., on the surface of a flat platelike conductive face material 11 except the parts formed with conductor circuits 13, 13' and dummy circuits 13''. With the material 11 with a resist mask 12 as a removing electrode it is faced at a predetermined distance from an anode 14, and the circuits 13, 13' and the dummy circuits 13'' are copper-electroformed by a high speed plating. The mask 12 is peeled off, and dummy circuit 13'' which is not built into a conductor circuit board is eventually removed. A mechanically removing method and a method for removing by chemical etching in a state that the circuits 13, 13' are protected by the resist mask or the like. A thin metal film 15 is formed on the whole surface of the material 11 only with the circuits 13, 13'. The metals used are copper, nickel, zinc, etc. |
