| 摘要 |
<p>PURPOSE:To prevent damage by collision and contact on the end face of resonator on a cleavage surface by separating cleavage-divided slender-shaped small piece without using adhesive agent for fixing a wafer. CONSTITUTION:In parallel with a stage end face 6 the end face of a wafer 1 is pushed out by a wafer transfer mechanism 8 so as to project from the stage end face 6 of a pitch of marking-off 2'. A wafer clamp mechanism 10 is descended, the wafer 1 is clamped and fixed on a stage 4. Next, the wafer end part for cleaving and dividing in slender form of the outside from the marking-off is clamped by a wafer end clamp mechanism 12, and the wafer 1 is cleaved and divided in slender-shaped small piece 19 by making the marking-off 2' cleaved and divided as a rotating center and rotating the wafer end clamp mechanism 12 in the direction at which the marking-off 2' is opened. Therefore, washing treatment is not needed without using adhesive agent on the wafer 1 and fixing it by the adhesive agent, and damage by collision and contact of the resonator end face on the cleavage surface can be eliminated.</p> |
