发明名称 CHIP-TYPE ELECTRONIC COMPONENT
摘要 <p>PURPOSE:To enhance protection and stability for the surface of a resistance coating as well as to make the coating surface smooth for avoiding a sucking failure at the time of component mounting, by applying a three-layered protective coating. CONSTITUTION:On both sides of a flat substrate 1, formed are electrode coatings 2 and 2, between which resistance coating 3 is formed so that it is conducted. Moreover, a three-layered protective coating is applied on the resistance coating 3; an undercoat glass layer 4 which is applied before trimming, a mediumcoat glass layer 5 which is applied after trimming and an overcoat glass layer 6 which is applied on top of the two. By this method, a high protection and stability is maintained while an easy control is gained over the accuracy in the direction of component thickness. Also, a sucking failure problem to be caused by use of a vacuum chuck is solved since a coating glass is applied so that the surface of which is made smooth.</p>
申请公布号 JPH01152701(A) 申请公布日期 1989.06.15
申请号 JP19870313248 申请日期 1987.12.10
申请人 ROHM CO LTD 发明人 DOI MASATO
分类号 H01C7/00;H01C17/06;H01C17/24 主分类号 H01C7/00
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