发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the outflow of a resin to the outside of an outer frame and the curing and adhesion of the resin by previously forming a recessed section for a resin trap to the outer frame in multiple lead frames. CONSTITUTION:Recessed sections 8 for resin traps are shaped previously to an outer frame 3 in multiple lead frames 1 so as to be communicated with a gate 28 or a runner. A resin leaking from the gates 28 flows and is stored into through-holes 8, which are formed to the outer frame 3 disposed so as to block the gates 28 and communicated with the gates 28 by intakes 9 arranged and shaped adjacent to the gates 28. Consequently, the resin does not flow out up to the nose sections of leads 6 opened at the terminal of principal after type lead frame 1 through the outer side face of the outer frame 3. Accordingly, the generation of the defective adhesion of a soldered film at the nose sections of the leads 6 is avoided.
申请公布号 JPH01152754(A) 申请公布日期 1989.06.15
申请号 JP19870312955 申请日期 1987.12.10
申请人 HITACHI LTD;HITACHI CHEM CO LTD 发明人 KIYOZUKA KOICHI;KASHIWABARA TAKAKI
分类号 H01L23/50;H01L21/56 主分类号 H01L23/50
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