| 摘要 |
<p>A process for removing unwanted photoresist material from the peripheral areas of a photoresist substrate characterized by the steps of: a) spin coating a photoresist solution onto a surface of a substrate, thereby applying a photoresist coating which comprises a uniform film over substantially all of said substrate surface except for unwanted photoresist material deposits at the peripheral areas of said surface; b) contacting said peripheral area of the coated substrate with a sufficient amount of a solvent mixture comprising a mixture of ethyl lactate and methyl ethyl ketone present in a volume ratio of about 65:35 to about 25:75, respectively, to selectively dissolve said unwanted deposits without adversely affecting said uniform film; and separating said dissolved deposits from said coated substrate.</p> |
