| 摘要 |
PURPOSE:To enable the surface of a workpiece to be polished into a satisfactory mirror surface for a short time by using specified aqueous solution for abrasives. CONSTITUTION:A wafer (a kind of workpieces) like silicon and a polishing machine are slid while abrasives are supplied to the surface of wafer to mirror polish said surface. Then, aqueous solution containing 0.05-0.2wt.% of aqueous amine, 0.05-1.0wt.% of abrasive grains, pure water and residue are used for abrasives. By setting thus the concentration of abrasive grains to 0.05-1.0wt.% can be reduced the damage of the surface of wafer due to the abrasive grains. Further, by setting the concentration of aqueous amine to 0.05-0.2wt.% can be intensified the solving action of aqueous amine, so that a wafer polishing time can be shortened. |
