发明名称 APPARATUS FOR CONNECTING HYBRID CIRCUIT TO MOTHER BOARD
摘要 <p>PURPOSE: To rigidly connect a circuit with a mother board without generating electric interference, by a method wherein the leg of a printed circuit board has protrusions to a plate itself, a mother board has an aperture corresponding to the leg, the aperture has no copper foils through the whole aperture, and a conductor foil of the protrusion and an earth foil are connected with a foil of the mother board, on the edge of the aperture. CONSTITUTION: The end of a cover 5 is provided with two notches 7 for accepting protrusions 3 of a printed circuit board 1, and two notches 8 for accepting protrusions 4. Further a 2-part notch is formed, through which legs stretch from a housing. A mother board 12 has apertures 9 corresponding to the legs, which are inserted into the apertures. The sides of the legs on which earth foils and conductor foils 2a, 2b are positioned coincide almost with the edges of the apertures 9. A foil of the mother board is one and positioned on the same side. The whole aperture is not turned into a copper foil, and, if necessary, the conductor foil of the mother board and the earth foil are positioned on the different sides of the mother board. The earth foil and the conductor foil on the leg 2 of the printed circuit board are connected with the earth foil and the conductor foil of the mother board 12, by welding on the parallel corresponding sides of the apertures.</p>
申请公布号 JPH01152686(A) 申请公布日期 1989.06.15
申请号 JP19880204827 申请日期 1988.08.19
申请人 NOKIA MOBIRA OY 发明人 RISUTO BEISENEN
分类号 H01R12/52;H05K1/02;H05K1/14;H05K3/36 主分类号 H01R12/52
代理机构 代理人
主权项
地址