发明名称 CIRCUIT BOARD HAVING IMPROVED THERMAL CONDUCTIVITY
摘要 <p>PURPOSE: To easily obtain a circuit board having an excellent thermal conductivity, by forming a printed wiring board from compound of electrically and thermally insulating resin and synthetic resin to which filler having an excellent thermal conductivity is added. CONSTITUTION: A circuit board on which an electronic element 3 or 8 is mounted is formed by using the following; a plate member 1 or 5 composed of polyarylether sulfone filled with aluminum flake, and a plate member 2 or 6 composed of thermally and electrically insulating polyarylether sulfone. An element 3 or 8 constituted by metal coating is fixed on the plate member 2 or 6 of the circuit board, by using a heat dissipating protrusion 4 or 7. The element 3 and 8 are mounted on the single face or both faces of the circuit board, and excellent thermal conductivity is imparted to the circuit board.</p>
申请公布号 JPH01150382(A) 申请公布日期 1989.06.13
申请号 JP19880273379 申请日期 1988.10.31
申请人 BASF AG 发明人 HERUMUUTO MIYUNSHIYUTETSUTO
分类号 H05K1/02;H05K1/03;H05K7/20 主分类号 H05K1/02
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