METHOD FOR MOLDING RESIN FOAM EQUIPPED WITH FLEXIBLE CIRCUIT MEMBER

摘要

PURPOSE:To build a flexible circuit member integrally in a resin foam by holding a flexible circuit member on a predetermined terminal position through a process that the flexible circuit member is nipped between the lower end of a coupler and the upper end of a sealing compression member and resin foaming liquid is injected in a space formed by a lower mold and an upper mold to be foamed and solidified. CONSTITUTION:The primary foaming layer 9a is integrally formed on the back surface of a covering member and the fifth mold 17 as the upper mold is set in the form of making a predetermined space in the primary foaming layer 9a therebetween. A coupler 15 and a printed wiring board 16 are fabricated in the predetermined position of the fifth mold 17 and the projection 14 of the fourth mold 13 intrudes into the inner space of the coupler 15. The lower surface of horizontal flange 20 of the coupler 15 comes into contact with the upper end of angularly cylindrical portion 10 of the primary foaming layer 9a via the printed wiring board 16 and the coupler 15 forcedly presses the angularly cylindrical portion 10 toward the fourth mold 13. The foaming liquid is injected into the space between the primary forming layer 9a and the fifth mold 17 and it is foamed and solidified so as to form a secondary foaming layer 9b. The printed wiring board 16 is nipped between the coupler 15 and the angularly cylindrical portion 10, the misregistration in the exposed surface 27 of a lead wire 24 never occurs.