SOLDERLESS TEMPORARY CONNECTING METHOD FOR COMPONENT,申请号JP19870310229-传众专利搜索

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发明名称	SOLDERLESS TEMPORARY CONNECTING METHOD FOR COMPONENT
摘要
申请公布号	JPH01150875(A)	申请公布日期	1989.06.13
申请号	JP19870310229	申请日期	1987.12.07
申请人	NEC CORP	发明人	OSHIMA TORU
分类号	G01R31/28	主分类号	G01R31/28
代理机构		代理人
主权项
地址

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