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经营范围
发明名称
High density board to board interconnection system
摘要
申请公布号
US4838798(A)
申请公布日期
1989.06.13
申请号
US19880207411
申请日期
1988.06.15
申请人
AMP INCORPORATED
发明人
EVANS, WILLIAM R.;GRANITZ, RICHARD F.;SCHMEDDING, GEORGE R.
分类号
H05K7/14;H01R12/04;H01R12/16;H05K1/14
主分类号
H05K7/14
代理机构
代理人
主权项
地址
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