发明名称 High density interconnect system
摘要 Plated-through-holes of printed circuit boards are segmented to provide a plurality of conductors. Matching connector pins having insulating cores and patterned conductive portions are mated with the conductors of the plated-through-holes. Each of the conductors of the holes can be connected to a different one of the patterns on the printed circuit boards thus forming a high density interconnect system.
申请公布号 US4838800(A) 申请公布日期 1989.06.13
申请号 US19880197200 申请日期 1988.05.23
申请人 GTE PRODUCTS CORPORATION 发明人 LYNCH, THOMAS M.
分类号 H05K3/00;H05K3/30;H05K3/40 主分类号 H05K3/00
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