| 摘要 |
<p>PURPOSE: To protect a circuit pattern against corrosion surely by providing a plate covering a circuit pattern and interposing an adhesive for bonding an IC module between the covering plate and a recess. CONSTITUTION: An external terminal 12 is provided on one side of a support 11, an IC chip 13 is provided through an adhesive 13a at the central part on the other side thereof and a circuit pattern 16 is provided at the outside part. A rectangular prism resin molding part 15 is formed around the wiring part including the IC chip 13 and a bonding wire 14. A plate 18 is bonded to the circuit pattern 16 while covering the circuit pattern 16 through an adhesive sheet 17 so that the circuit pattern 16 is not exposed to the outside. An IC card is produced by applying an adhesive 26 to the bottom face of a recess 25a in the basic material 20 of card, inserting an IC module 10 into the recess 25 and then pressing the IC module 10. Since a plate 18 covering the circuit pattern 16 is provided, the circuit pattern is protected against corrosion due to direct contact with the adhesive when the IC module 10 is fixed in the recess 25 in the basic material of card.</p> |
