Test fixture for tab circuits and devices

摘要

A test fixture for TAB (Tap Automated Bonding) circuits includes circuit boards for maintaining a characteristic impedance to inner lead bond areas of a circuit under test. A plurality of vertically disposed test pins are soldered to conductors in one of the circuit boards, and provide contacts for supplying power and test signals to test pads on a circuit under test. A thermoelectric heat pump is thermally connected to a circuit under test with a copper thermal chuck or heat spreader, and is used to subject the circuit to a wide range of operating temperatures. A two piece anvil is provided to apply pressure to the test pad/test pin interface and to the circuit die/thermal chuck interface.