| 摘要 |
<p>PURPOSE:To mount a semiconductor pellet with high positional precision thereby restraining the wire length from dispersing for improving the characteristics by a method wherein, when a pellet is mounted on a semiconductor device for ultrahigh-frequency, X.Y.theta are corrected in the state of the pellet adsorbed at a nozzle. CONSTITUTION:A pellet 1 is picked up by a mount (adsorbing) nozzle 5 on an adsorbing stage 3. First, a mount arm 6 is shifted to an intermediate stage 10 to pick up the state of pellet position at the end of the mount nozzle 5 as an image for processing the X.Y slippage amount A of the pellet 1. Then, the slippage amount A is corrected by an X-Y table 8 for mount head 7. Second, the mount arm 6 is further shifted to a mount stage 9 to mount the pellet 1 on a semiconductor component (case) 14. Finally, the mounting process with higher precision can be performed due to the correction of X.Y.theta.</p> |
