| 摘要 |
PURPOSE:To separate the void liable to remain on the laminated surface in order to secure the plate thickness accuracy of a molding by laminating an inner layer plate, to which a copper foil is stuck, a copper foil or a copper- pasted laminated layer plate on the peripheral part and between circuit units through prepreg. CONSTITUTION:Four pieces of the same circuit units 1 are arranged on an inner layer plate 5, while circular copper foils having a diameter of 5mm are stuck between the units 1 and 2 as well as on the peripheral part 3. Epoxy resin prepreg 6 and a copper foil 7 of 18mum are piled up and down the inner layer plate 5 for being molded with heat and pressure. Even when a copper- plated laminated plate, wherein the copper foil is laminated on a glass epoxy resin substrate, is used in place of the copper foil 7, a multilayer plate being excellent in the plate thickness accuracy and having no remaining void can be obtained. Thereby, the void liable to remain on the lamination surface is removed so that the plate thickness accuracy of the molding can be secured. |
