| 摘要 |
PURPOSE:To simplify a working process, and enable a suitable correspondence with the change of kind, only by changing the data of junction position, by contact-bonding an electrode group of a wiring circuit board and an electrode group of a semiconductor, via metal balls of uniform size, and joining the electrode groups. CONSTITUTION:By contact-bonding the electrode group 7 of a wiring circuit board 6 and the electrode group 13 of a semiconductor 8, via metal balls 3 of uniform size, the electrode groups 7, 13 are joined. For example, metal balls 3 of uniform size, which are made of gold, silver, aluminum, etc., and mounted on a tray 2 having a lot of semispherical holes 1, are taken out by sucking them with a capillary 5. By thermal contact bonding, these metal balls 3 are joined in turns to the electrode group 7 on the wiring circuit board 6. The rear of the semiconductor chip 8 is sucked by a tool 11 which is installed at the tip part of a supersonic wave horn 9 and has a suction groove 10. The electrode group 7 of the wiring circuit board 6 mounted on a table 12 heated at 20-30 deg.C, and the Al electrode 13 of the semiconductor chip 8 are bonded en bloc, via the metal balls 3. |
