| 摘要 |
<p>PURPOSE:To increase packaging density by mutually connecting a plurality of hybrid integrated circuit substrates through a chip part with two electrodes. CONSTITUTION:A plurality of hybrid integrated circuit substrates 1, 11 are connected mutually through a chip part with two electrodes such as a chip capacitor 6, a chip resistor, etc. A conduction path pattern 2, an electrode land 3, a resistor pattern 4, etc., are formed onto the main substrate 1 composed of ceramics, and a clip terminal 5 is fitted around the main substrate 1. A lower electrode for the vertically erected chip capacitor 6 is connected to the electrode land 3, and an electrode land shaped onto the rear of the sub-substrate 11 on which a semiconductor chip 8 is loaded is connected to an upper electrode, and the sub-substrate 11 is formed in double substrate constitution in which it is superposed onto the main substrate 1, interposing the chip capacitor 6.</p> |
