| 摘要 |
PURPOSE:To prevent the side etching of a copper layer pattern by forming a thin film composed of a substance except copper onto the surface of a thin copper plate, etc., shaped to a base material and form ing an etching-resistant protective film consisting of an organic matter having affinity with copper only on the side face of a copper layer without being shaped to the thin-film. CONSTITUTION:A thin-film 8 made up of a substance except copper such as tin, lead, zinc, etc., is shaped onto the surface of a thin copper plate 12 or a thin copper film 16 formed to a base material 10, and the pattern of a resist layer 20 composed of a dry film or resist ink is shaped onto the thin-film 18. Said thin-film 18 is removed with the exception of a section coated with said resist layer 20, the conductor pattern of a copper layer 24 is formed onto the thin-film 18 removing surface through plating, and the surface of said copper layer 24 is plated with a metal 28 except copper and the resist layer 20 is gotten rid of. An etching-resistant protective film 26 consisting of an organic matter having affinity with copper is shaped onto the side face of the copper layer 24 exposed, and the thin-film 18, to which the protective film 26 is not formed, and the thin copper plate 12 or the thin copper film 16 under the thin-film 18 are etched and treated with an etchant, thus forming a conductor pattern. |
