| 摘要 |
PURPOSE:To enhance bond strength of a resin molded section to a substrate so that the resin molded section is effectively prevented from being removed even if impact is given to the molded section, by providing holes in a part of a substrate where there is no conducting pattern so that the resin flows also into these holes during the resin molding process. CONSTITUTION:An LED chip 13 is attached to a predetermined position on a substrate 11 of glass epoxy or the like having conducting patterns 12 on the top face thereof, and the chip is wire bonded. After packaging in this manner, the top face of the substrate 11 is molded with resin 15. In a chip LED 10 thus produced, one or more holes 11a, 11b are formed in said substrate 11 where the conductive patterns 12 are not provided, so that the resin used for the molding flows also into these holes 11a, 11b. Said holes 11a, 11b may be either through holes reaching the lower face of the substrate or blind holes extending halfway. |
