| 摘要 |
PURPOSE:To facilitate positioning of lands of both substrates and to improve the adhering strength of a whole periphery of a terminal section including a soldered section by forming a through hole from the end of the land toward the end of the substrate, adhering the film at the periphery of the through hole, and reinforcing the soldered section. CONSTITUTION:In order to adhere a substrate 1a to a printed substrate 3, a through hole 8 formed from the end 2a of a land 2 toward the end 1b of the substrate is first aligned to the land 4 of the printed substrate, and adhering position is determined. Then, the film 5 of the substrate 1a is adhered with an adhesive 7 to the substrate 3. In this case, the film 5a of the periphery of the hole is adhered. Thereafter, the lands 2 of the substrate 1a are soldered to the lands 4 of the printed substrate with soldered part 6. In this case, since the hole 8 of the same width as that of the land 2 is formed from the end 2a of the land 2 toward the end 1b of the substrate, the adhering strength of the film 5a of the periphery of the hole to the printed substrate 3 fixes the soldered part 6 and particularly adheres it to the substrate 3. Large reinforcing force is provided to fix a solder-adhered part 6a. |
