| 摘要 |
<p>PURPOSE:To prevent dust from blowing up and to obtain a wafer attaching/ detaching device with high reliability by providing a movable base moving in parallel synchronously with a wafer processing base, and a lifting mechanism for elevationally moving a wafer at the movable base, thereby slowly placing the wafer onto the processing base at the time of detaching or attaching it. CONSTITUTION:A wafer 3 conveyed from a wafer carrier 1 to a belt 2 is held by a chuck 4, conveyed to a wafer processing base 5 which is continuously moved, and lifted by a lifting mechanism 7 secured to a moving base 6 moving synchronously with the position of the base 5. The base 5 is formed with several holes through which the pins 8 of the mechanism 7 are passed, the wafer 3 lifted through the hole is isolated by the chuck 4, the chuck 4 is then moved, the wafer 4 remains on the pins 8 of the mechanism 7, and placed on the base 5 by slowly moving down the pins 8. Thus, it prevents dust from blowing up and obtains the wafer attaching/detaching device with high reliability.</p> |
