| 摘要 |
PURPOSE:To enable the very easy judgement of the quality of a bonded part, by giving vibrations to an article to be matched and by applying a laser beam thereto. CONSTITUTION:A circuit 2 is formed on one surface of a chip 1 of silicon or the like, which is a semiconductor element, and an electrode 3 is provided in the periphery of the chip. This electrode is joined, on a machining base 6, to an electrode 5 for joining which is provided in the end on the lead frame 4 side. When vibrations are given from an appropriate vibration source 7 to an article to be machined and when there is a gap or an incompletely bonded spot in the article, the state of vibrations therein is different from that in the other normal part. In other words, the speeds of propagation of the vibrations are different. When the vibrations are ultrasonic waves, therefore, a coherent light of a laser 8 or the like is applied thereto and reflected therefrom and a change in interference fringes obtained therefrom through optical systems 9 and 10 can be observed. When this change is detected by an appropriate pattern recognizing device and marked, an imperfect element or spot is stored by a data processing executed by a computer, and the data thus stored are taken out after machining and can be modified or reused. |
