发明名称 |
Method and apparatus for removing coating from substrate |
摘要 |
In a method and apparatus for plasma stripping a polymer photoresist coating from a semiconductor substrate, ultraviolet radiation generated as a byproduct of plasma generation is absorbed by a baffle placed between a plasma source and the substrate. The baffle inhibits incidence of ultraviolet light on the substrate while permitting flow of activated gas onto the substrate to chemically strip the photoresist from the substrate. Use of the baffle reduces microscopic damage to the substrate.
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申请公布号 |
US4836902(A) |
申请公布日期 |
1989.06.06 |
申请号 |
US19870106214 |
申请日期 |
1987.10.09 |
申请人 |
NORTHERN TELECOM LIMITED |
发明人 |
KALNITSKY, ALEXANDER;ELLUL, JOSEPH P.;TAY, SING P. |
分类号 |
G03F7/42;H01J37/32;H01L21/311 |
主分类号 |
G03F7/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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