| 摘要 |
PURPOSE:To prevent tombstone phenomenon by connecting a pad to be connected with a power source pattern by a connecting pattern which is thinner than the width of this pad. CONSTITUTION:At least one pad, to be connected with a power source pattern, of a pair of pads facing each other is connected by means of a connecting pattern which is thinner than the width of this pad, so that heat quantity to escape from this pad to the connecting pattern at the time of soldering is restricted and that solder reflow time becomes uniform. Tombstone phenomenon in which a surface mounted part is pulled to stand by surface tension of solder can thus be prevented. |
