| 摘要 |
PURPOSE:To perform checking operation automatically, by detecting the reflected light of laser light, which is made to scan at a wire-bonded part, and judging the bonded state. CONSTITUTION:Laser light L, which is reflected from a semiconductor chip 1, is detected with a detector 8, wherein many detecting elements are arranged in a matrix state. An operating part 9 processes the signal from the detector 8 in synchronization with the signal of a rotary angle from a driving motor 3. The signal, which is processed in the operating part 9, is compared with a value, which is set beforehand, in a compairing part 11. The quality of wire bonding is judged in a judging part 12 based on the comparison. |
