| 摘要 |
<p>PURPOSE:To use a conveyer for cylindrical and leadless resistors and capacitors in common and facilitate rationalization of board mounting by a method wherein a resin package is formed cylindrically and leads protruding from the circumferential surface are wound around the circumferential surface of the package. CONSTITUTION:A resin-sealed part 11 for sealing a semiconductor device is molded with epoxy resin or polyphenylenesulfide solidly so as to have an approximately cylindrical form as a whole. Leads 12 ara connected to the semiconductor device in the resin-sealed part 11 and made to protrude from the circumferential surface 11a of the resin-sealed part 11 and bent and wound around the circumferential surface 11a of the resin-sealed part 11. In order to facilitate mounting on a board or the like, films of tin or tin alloy with thicknesses of 1-50mum are applied to the surfaces of the leads 12. As the semiconductor device itself is molded to have a cylindrical form, a conveyer or the like for cylindrical and leadless resistors and capacitors can be used in common and, moreover, the semiconductor devices can be conveyed continuously by loading them in a conveying pipe.</p> |
