发明名称 SELF-BONDING RESIN COMPOSITION
摘要 PURPOSE:To obtain a self-bonding resin composition of improved abrasion resistance, by adding a specified amount of fine organic resin powder coated with a fluorocarbon resin to a self-bonding resin composition formed by mixing a phenoxy resin with 2,2'-(1,3-phenylene)bis(2-oxazoline). CONSTITUTION:A phenoxy resin or a mixture (A) thereof with an epoxy resin (e.g., bisphenol epoxy resin) is mixed with 2,2'-(1,3-phenylene)bis(2-oxazoline) or its derivative (B) of a structure as shown in the formula and an organic resin powder (C) surface-coated with a fluorocarbon resin of a mean particle diameter <=20mum (e.g., fine polyethylene or polypropylene powder) in such a ratio that the amount of component C is 0.01-15pts.wt. per 100pts.wt. total of components A and B. This mixture is molten in a solvent (e.g., cyclohexanone) to produce a self-bonding resin composition excellent in hot meltability, heat resistance and abrasion resistance.
申请公布号 JPH01141948(A) 申请公布日期 1989.06.02
申请号 JP19870302049 申请日期 1987.11.30
申请人 SHOWA ELECTRIC WIRE & CABLE CO LTD 发明人 NAKAMURA HIROAKI;WAKE MISAO
分类号 C08L79/06;C08G73/02;C08K7/16;C08K9/04;C08L71/08;C08L71/10;C08L71/12;C08L79/04;H01B3/30;H01B3/40;H01B7/02 主分类号 C08L79/06
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