| 摘要 |
PURPOSE:To eliminate a positional deviation when an optical semiconductor chip is mounted on a package, by a method wherein, at least two or more projections are provided in the vicinity of the center of the surface of the package, and the optical semiconductor chip having holes for fitting into the projections on the back surface thereof is loaded on the package and bonded with each other by a conductive bonding member. CONSTITUTION:Two projections 4 are provided on the center part of a package 3. Two holes are provided in the back surface of a light-receiving integrated circuit chip 1. After a cream solder 7 is applied to the center part of the package 3, the chip 1 is loaded on the package 3 so that the projections 4 on the package 3 are fitted into the holes 2 on the chip 1, the cream solder 7 is cured, and the chip 1 is fixed to the package 3. On the package 3, electrode rods 5 are fixed with a low-melting glass 6 so as to be projected 0.3-0.5mm from the surface of the package 3. Pads 9 on the chip 1 and the electrodes 5 are connected to each other with aluminum wires 8 using a wire bonder. In this manner, even if the pad 9 on the chip 1 and the electrodes 5 are increased in number, the positional relation and distance between the pads 9 and the electrodes 5 can be respectively kept proper by the projection parts 4 and the hole parts 2. |
