发明名称 MOLDABLE/FOLDABLE RADIO HOUSING
摘要 This invention pertains to housings for electronic devices, and more particularly, to a molded housing for a radio receiver. Typical prior art housings require a large number of individual parts, and the variety of manufacturing processes and materials necessary to manufacture these parts elevates manufacturing costs. To reduce the total number of individual parts, the present invention comprises a molded thermoplastic housing (100) including a base (102) and cover (104) members joined by a living hinge (106). Solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of both housing members. The printed circuit patterns on opposing surfaces of the base and cover members are joined by conductive through-holes (120 and 122). The printed circuit patterns on the interior surfaces of the base and cover members are joined by an interconnecting printed circuit pattern (124) which is vacuum deposited onto the living hinge.
申请公布号 WO8905066(A1) 申请公布日期 1989.06.01
申请号 WO1988US03586 申请日期 1988.10.17
申请人 MOTOROLA, INC. 发明人 URBISH, GLENN, F.;MCKEE, JOHN, M.;MCKINLEY, MARTIN, J.;SUPPLESA, ANTHONY, B.
分类号 H04B1/08;H04B7/26;H04Q7/14;H05K1/00;H05K1/11;H05K1/18;H05K3/00;H05K3/32;H05K7/06;(IPC1-7):H04B1/08 主分类号 H04B1/08
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