发明名称 |
Semiconductor contact arrangements |
摘要 |
The contact arrangement comprises a semiconductor wafer 1 having on one of its major faces 9 an area 4 of one type of conductivity and an electrical contact 11 in face-to-face engagement with that area, in which the contact is located with respect to that area and is secured to the wafer by a stud 15 welded to the wafer and projecting into a hole 14 extending through the contact. The stud may comprise an aluminium ball which is deformed by welding to secure the contact to the wafer. To prevent a preferential electrical path through the weld, the stud may be surrounded by an insulating sleeve. <IMAGE> |
申请公布号 |
GB2210200(A) |
申请公布日期 |
1989.06.01 |
申请号 |
GB19880028998 |
申请日期 |
1988.12.12 |
申请人 |
* WESTINGHOUSE BRAKE AND SIGNAL HOLDINGS LIMITED |
发明人 |
C V H * MILES;P L T * BISHOP |
分类号 |
H01L23/482;H01L23/485 |
主分类号 |
H01L23/482 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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