| 摘要 |
PURPOSE:To produce the title structure for holding a sputtering target free of cracking with a simple process by placing an oxide in the recess of a packing plate, vacuum-sealing the oxide, and compacting the oxide. CONSTITUTION:In the packing plate 1 made of copper and having the recess 2 provided with an O ring groove 3 and a bolthole 4, the recess 2 is separated into plural sections by a partition plate 6. The same or different oxides and/or the mixed powder 5 of oxides (e.g., BaO, CuO, Y2O3, etc.) are placed in each section, and the whole packing plate 1 is immediately vacuum-sealed 7. The packing plate 1 is compressed from the periphery by cold hydrostatic compression, etc., to compact the powder 5, and a compact is obtained. The holding structure free of cracking is obtained from the compact with a simple process without using a bonding material. |
