发明名称 EPOXY RESIN COMPOSITIONS FOR USE IN LOW TEMPERATURE CURING APPLICATIONS
摘要 <p>Compositions comprising a mixture of (A) an epoxy resin composition consisting essentially of (1) at least one epoxy resin which has an average of not more than 2 vicinal epoxy groups per molecule; (2) at least one epoxy resin which has an average of more than 2 vicinal epoxy groups per molecule and (3) at least one rubber or elastomer; and (B) optionally, a low viscosity reactive diluent, are useful in preparing low temperature curable compositions. Also claimed is low temperature curable compositions containing the above components (A) and (B); (C) at least one cycloaliphatic amine hardener and (D) optionally, an accelerator for component (D).</p>
申请公布号 AU2715088(A) 申请公布日期 1989.06.01
申请号 AU19880027150 申请日期 1988.10.21
申请人 THE DOW CHEMICAL COMPANY 发明人 PAUL L. WYKOWSKI;PAUL M. PUCKETT
分类号 C08G59/00;C08G59/20;C08G59/38;C08G59/50;C08L;C08L33/08;C08L63/00;C08L63/02;C08L63/04 主分类号 C08G59/00
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