METHOD OF MAUFACTURING AN IDENTITY CARD, AND IDENTITY CARD

摘要

This identity card has an IC chip which is loosely attached to a carrier having contacts, several layers, predominantly consisting of a thermoplastic, of a layer structure with cut-outs for accommodating the carrier with its IC chip being welded together under pressure and temperature. Known methods have the disadvantage of an extremely large expenditure of material and process engineering during the production of the identity cards. This disadvantage is eliminated by the fact that the IC chip protruding past the underside of the carrier is inserted during the welding-together of the layer structure into a cut-out, closely matched to the profile of the IC chip, in a layer of the layer structure on which the carrier is supported and that the IC chip is embedded in the cut-out by thermoplastic flowing in towards the end of the welding process.