CERAMIC CIRCUIT SUBSTRATE

摘要

PURPOSE:To provide a ceramic circuit substrate capable of effectively radiating the heat generated by a heating electronic part also avoiding the erroneous operations of another electronic part formed or arranged on the circuit substrate while enhancing the thermal reliability and shortening the level thereof for attaining the high density of surface wiring. CONSTITUTION:A heat sink metallic member 5 covered with a surface side insulating layer 1a is innerly packaged in a circuit substrate 1 wherein wirings 3 connected by via hole connectors 4 between insulating layers 1a-1e comprising a ceramic body are arranged while a heating electronic part mounting region A of said insulating layer 1a covering the heat sink metallic member 5 is also provided.