发明名称 ALUMINUM NITRIDE MULTI-LAYER BOARD
摘要 <p>PURPOSE:To provide an aluminum nitride multi-layer board which has excellent mounting reliability to a printed board which is the mother board. CONSTITUTION:An aluminum nitride multi-layer board 2 is surface-mounted on a printed wiring board through a plurality of short pins. Dummy short pins 13, which do not influence electric connection, are provided so as to surround the short pins 12a on the outer circumference on which heat stress tends to concentrate.</p>
申请公布号 JPH07130909(A) 申请公布日期 1995.05.19
申请号 JP19930275795 申请日期 1993.11.04
申请人 IBIDEN CO LTD 发明人 AKIYAMA SUSUMU
分类号 H01L23/12;H05K3/30;H05K3/34;(IPC1-7):H01L23/12 主分类号 H01L23/12
代理机构 代理人
主权项
地址