SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FORMING SAME

摘要

An assembly for a light emitting device is disclosed which utilizes a lens (22) formed in direct contact with both the light emitting device and its supporting mount structure so as to completely encapsulate the device and substantially cover the top major surface of the mount. The lens is applied in liquid form and naturally flows to assume a convex structure and encapsulate the emitting device. Due to its viscosity, the lens material, as it flows, will conform in shape to the dimensions of the mount. In a preferred process, the lens material is applied to the assembly by means of a printing fixture (30) including a dependent pin (32) for transferring a drop (36) of the material to the assembly.