| 摘要 |
PURPOSE:To improve moisture resistance and heat sink property and to enhance the reliability of a semiconductor device by filling silicone gel around the projected electrode of a pellet placed on a circuit substrate, and perform sealing with a sealing material between the periphery of the pellet and the substrate. CONSTITUTION:A ceramic multilayer interconnection substrate 1 is connected through a solder bump 2 to external wirings, and connected through inner wirings 3 connected to the bump 2 and a solder bump 4 to the electrodes of a pellet 6. The outer periphery of the bump 4 of the pellet 6 is sealed with silicone rubber 5 for evacuating the interior in vacuum. Silicone gel 7 is uniformly filled in an inner space sealed with the rubber 5. Thus, moisture resistance and heat sink property are improved, thereby improving the reliability of a semiconductor device.
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