| 摘要 |
A printed wiring board is disclosed which has one or more solder pads of special configuration which receive and contain excess solder which might otherwise bridge adjacent downstream leads of a component having closely spaced leads when the component is mounted to the printed circuit board in a wave-soldering process. The special solder pad configuration may be viewed as an extra solder pad (a "robber pad") at the downstream end of a linear array of solder pads which is connected to the adjacent upstream solder pad by a solder-wettable bridge.
|
