| 摘要 |
PURPOSE:To miniaturize the title substrate assuring high heat dissipating property by a method wherein conductors and resistors are formed on an insulating film formed on a metallic heat dissipating plate. CONSTITUTION:A metallic heat dissipating plate 1 such as aluminum is coated with an inorganic insulating film 2. Conductors and resistors 3 are pattern- formed by the same thick filming process as that to form the conductors and resistors on ordinary ceramic substrate i.e. the patterns are formed by printing and baking copper paste, etc., by screen printing process, etc. Next, a semiconductor element 4 is mounted on the insulating film 2 to be sealed with liquid sealing resin 5 later. Furthermore, in case S: a chip, the chip can be bonded directly onto the substrate to be sealed with resin, etc. |
