METHOD OF TRANSCRIPTING PATTERN ON TO SUBSTRATE MATERIAL BY REACTIVE ION ETCHING

摘要

PURPOSE: To form a pattern on a substrate by selectively performing reactive ion etching of a substrate such as organic polymer and silicon by using improved etch barrier material. CONSTITUTION: A layer 12 of barrier material having resistance to reactive ion etching is spread on a silicon substrate 10. A resist layer 14 is stuck on the barrier layer 12. The resist layer 14 is exposed in a pattern shape with radioactive rays, and the barrier layer 12 is eliminated after the exposed resist layer 14 is eliminated. A desired trench 18 is formed by performing reactive ion etching of the substrate 10. The barrier layer 12 acts as a mask of the substrate 10 of the lower side which is not exposed. Thereby, a pattern is formed on the substrate 10.