ROUND SOLDER PAD FOR SURFACE MOUNTING ELECTRONIC DEVICES AND A SURFACE MOUNTING POSITION INCORPORATING SUCH SHAPED PADS

摘要

A ROUND SOLDER PAD FOR SURFACE MOUNTING ELECTRONIC DEVICES AND A SURFACE MOUNTING POSITION INCORPORATING SUCH SHAPED PADS Astract of the Disclosure Solder pads for the surface mounting of devices on a circuit board are given a round shape of predetermined size, By such shaping of a solder pad, or contact pad, a device will be held in, or moved to, a desired position on the melting of the solder at the pad. Improved alignment and positioning is obtained.