| 摘要 |
PURPOSE:To prevent the clogging and one-sided abrasion on the surface of a polishing cloth and drastically prolong the service life of the polishing cloth by reversing the revolution direction of a surface plate during polishing. CONSTITUTION:A wafer 1 is pressed onto a surface plate 4 having a polishing cloth attached onto the surface, and a relative movement is generated between the surface of the polishing cloth 3 on the surface plate 4 and the surface of the wafer 1 by revolving the surface plate 4 around the axis line, and the surface of the wafer 1 is polishing-worked. During the polishing, the revolution direction of the surface plate 4 is reversed according to a program. By this reverse revolution, the surface of the polishing cloth 3 is erected to the reverse direction, and the cut chips 6 and abrasive grains 7 confined on the surface of the polishing cloth 3 are forcibly discharged from the surface of the polishing cloth 3. At the same time, a fresh polishing liquid is supplied and held onto the surface of the polishing cloth 3 in substitution of the cut chips 6 and abrasive grains 7. Therefore, the clogging and one-side abrasion of the surface of the polishing cloth 3 can be prevented, and the polishing liquid supplied onto the surface is prevented from being discharged outside uselessly, and the wafer 1 can be surface-polished economically. |
