| 摘要 |
PURPOSE:To uniformly polish the undersurface of a wafer by uniformly supplying a polishing liquid onto the whole undersurface of the wafer in the inside part of a carrier plate by forming a plurality of polishing liquid feeding ports of the polishing liquid feeding holes formed on a surface plate, on the polishing surface of the surface plate. CONSTITUTION:In the state where a wafer 5 is pressed onto the polishing surface 6a of a surface plate 6, said surface plate 6 is revolution-moved around an axis line O, and a polishing liquid is supplied onto the polishing surface 6a of the surface plate 6, providing a relative movement between the surface of the wafer 5 and the polishing surface 6a of the surface plate 6, and the undersurface (obverse surface) of the wafer 5 is polishing-worked. In this case, the polishing liquid is supplied onto the polishing surface 6a of the surface plate 6 from a feeding port 9 formed in the center part of the surface plate 6 and a feeding port 9 formed on the outer peripheral part of the surface plate 6, passing through a liquid feeding hole 8 on the surface plate 6. The supplied polishing liquid is uniformly supplied onto the whole undersurface of the wafer 5 in the inside part of a carrier plate 2, accompanied with the revolution of the surface plate 6 and a carrier plate 9, and the undersurface of the wafer 5 can be uniformly polishing-worked. |
