| 摘要 |
PURPOSE:To miniaturize each electrode for a semiconductor laser array element by supporting a plurality of leads for inputting a signal by an insulator base body, arranging the end sections of these leads in response to respective electrode in a plurality of laser-beam outgoing regions and joining the end sections with these electrodes. CONSTITUTION:Leads in the same number as electrodes for a semiconductor laser array element 11 are disposed in parallel at the same intervals, and monolithic-molded into a flexible filmy insulator base body, thus manufacturing a lead 13. These lead electrodes 17 are joined with the electrodes for the element 1 through thermocompression bonding by using solder. Pawls 15 are fitted into pawl holes 18 shaped to a photo-receptor base 16, and the lead 13 is fixed. Consequently, since the lead 13 has flexibility, the areas of the electrodes 17 can be designed in size approximately the same as those of the electrodes for the joined element 11 even when there is a stepped section between an electrode section for the array element 11 and the photo-receptor base 16, thus efficiently dissipating the heat generation of the array element 13. A positional displacement margin, etc., at the time of wire bonding need not be considered at all, thus allowing miniaturization. |
