| 摘要 |
PURPOSE:To improve heat emission properties by leaving an exposed hole not coated with a sealing resin in one region of a semiconductor element. CONSTITUTION:Connecting sections with bonding wires 3 in the surface of a semiconductor element 1, the bonding wires 3 and one parts of leads 2 are coated with a resin 4, and each one part of the circuit surface, rear or both surface and rear of the semiconductor element 1 is exposed through an exposed hole 5. The semiconductor element 1 is coated with a resin film 6 for coating having excellent adhesion with the sealing resin 4 and superior moisture resistance. Accordingly, stress applied to the semiconductor element 1, the sealing resin 4 and the leads 2 at the time of thermal expansion is reduced, thus preventing the generation of cracks in the semiconductor element 1 and the sealing resin 4. |
