| 摘要 |
PURPOSE:To eliminate the movement of a semiconductor chip at the time of sealing by a method wherein supporting electrodes provided on the semiconductor chip and supporting leads are connected to each other by wires to increase the number of wires for holding the chip and to increase a force for holding the chip. CONSTITUTION:Four pieces of supporting electrodes 18 provided at the 4 corners of a semiconductor element 12 are formed simultaneously with electrodes 15. Supporting leads 19 are formed on the diagonal lines of a lead frame from the 4 corners of the lead frame in such a way that the leads 19 do not come into contact with inner leads 14 and are positioned in the vicinities of the electrodes 18. The electrodes 18 and the leads 19 of the lead frame are connected to each other by bonding wires. Hereupon, the number of wires for holding the element 12 is increased and a force for holding the element 12 is increased. Thereby, the movement of the element 12 at the time of sealing is eliminated. |
