| 摘要 |
<p>PURPOSE:To reduce cracks at resin seal materials by electrically connecting an inner lead section and a semiconductor chip with bonding wire, by sealing them with resin seal materials and by providing notches in and around a section whereto a semiconductor chip of each inner lead section is fixed. CONSTITUTION:An insulating film 2 is bonded to an inner lead section 15 of a tabless lead frame 1 with adhesive and a 4MDRAM semiconductor chip 4 is mounted on the insulating film 2. The inner lead section 15 and a semiconductor chip 4 are electrically connected to a bonding wire 5 and sealed with resin seal material 6 such as resin. A rectangular through hole 16 is provided in and around a section whereto a semiconductor chip 4 of the inner lead section 15 is fixed. Adhesion strength of the resin seal material 6 and the inner lead section 15 can be increased by increasing their ratio thus reducing cracks caused by thermal stress such as temperature cycles.</p> |
