发明名称 MANUFACTURE OF MULTILAYER INTERCONNECTION BOARD AND DEVICE THEREFOR
摘要 PURPOSE:To obtain a multilayer base material by a method wherein a superconductor thin film is formed on a ceramic base material, which is irradiated by a laser beam to form a wiring on it, and substrates are made to adhere to the base material, which are press-bonded as it is heated to obtain a multilayer board. CONSTITUTION:Both faces of a ceramic base material 1 are degreased, and the base material 1 is placed in a vacuum vessel 5 apart from its lower part by a required distance, where the pressure in the vessel 5 is between 10<-6>-10<-8>Torr. The base material 1 is coated with a superconductor (for example, La-Sr-CuO, Y-Ba-Cu-O, or organic substance) evaporated from the lower part of the vessel 5 to form a superconductor thin film, which is irradiated by a laser beam for the formation of a wiring 2. The base material 1 applied with an adhesive agent on its both faces is sandwiched between substrates 4, which is press-bonded as it is heated. By these processes, a multilayer board can be obtained.
申请公布号 JPH01134997(A) 申请公布日期 1989.05.26
申请号 JP19870292883 申请日期 1987.11.19
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAKURA YOSHINORI
分类号 H01L23/15;H01L21/603;H01L23/14;H01L39/02;H01L39/12;H01L39/24;H05K3/46 主分类号 H01L23/15
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