发明名称 METHOD AND APPARATUS FOR MANUFACTURING MULTILAYER INTERCONNECTION BOARD
摘要 PURPOSE:To obtain a thin film having preferable conductivity and preferable uniformity on the surface of a ceramic base material by adhering a metal foil formed with a predetermined pattern on both side faces of the material, mounting a ceramic product in a vacuum vessel of specific range, forming a thin superconductor film, then baking it to form interconnections of the superconductor film and heating and press-bonding substrates on both side faces of the material. CONSTITUTION:A ceramic material 1 is cleaned, a metal foil 5 formed with a predetermined pattern 6 is adhered to form a thin superconductor film, and baked at the optimum sintering temperature of the film, thereby forming interconnections of the superconductor film. Then, substrates 4 are adhered to both side faces of the material. The material 1 is contained in a vacuum vessel, the vessel 8 is evacuated to 10<-6>-10<-8>Torr, and a film coating source 10 is heated by a heater 9 until vapor is generated. When the vapor is generated, it is simultaneously ionized by a glow discharge, sequentially deposited on the material 1, thereby forming a thin superconductor film. While the film is deposited, since the material 1 is rotated by a driving motor 12 at a predetermined speed, a uniform thin film is obtained.
申请公布号 JPH01135096(A) 申请公布日期 1989.05.26
申请号 JP19870293662 申请日期 1987.11.20
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAKURA YOSHINORI
分类号 H01L23/15;H01L21/603;H01L23/14;H01L39/12;H01L39/24;H05K3/46 主分类号 H01L23/15
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